Measuring the height of circuit boards during assembly
Detecting circuit board location in an automatic assembly process
You wish to ensure circuit boards are assembled at the correct location in an automatic assembly process that places circuit boards in an enclosure.
[Issue] Defects caused by a failure to secure the board at the appropriate location during automatic installation
Circuit boards are supported by four snap-fit (clip) mechanisms. During automatic assembly, insufficient downward pressure on the circuit board can cause the board to stop before the snap-fit (clip) mechanism fully engages, resulting in a defect in which the board is not secured in the appropriate location.
[Solution] Install Micro Laser Distance Sensors above and below the detection target and use them to measure thickness.
Use an HG-C Series Micro Laser Distance Sensor to measure the distance to the circuit board after automatic assembly of the circuit board in the enclosure.Micro Laser Distance Sensor to measure the distance to the circuit board after automatic assembly of the circuit board in the enclosure.
If the distance between the sensor and the circuit board is 100 mm or less, determine that the board is unsecured (defective).
If a board is determined to be unsecured (defective), you can avoid sending a defective part on to the next process by reapplying downward pressure on the circuit board to eliminate the float.

Key considerations in choosing a sensor

Contactless testing
This setup is capable of contactless testing! It can accommodate measurements of products that are easily scratched.
High-precision measurement
This setup is capable of high-precision measurement with repeatability of 10 μm (when using the HG-C1030)!
Easy installation
The sensors feature a compact design with a built-in amplifier! Installation is simple.
Lightweight, rugged design
Thanks to their aluminum die-cast enclosure, these sensors are lightweight and rugged! The design reduces elements of instability in measurement precision caused by enclosure deflection and temperature.
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