Constructed for high reliability in various environments, these six connectors will make mobile devices tougher than ever.
Tough against dropping
High contact reliability is a requirement against the shock and vibration that are unavoidable when it comes to use of mobile devices.
Tough against foreign particles and flux!
Patented in Taiwan and Japan.
Even when it comes to ultra-miniature electromechanical parts, the demand is increasing for parts that can be used and stored under various environments.
Tough against corrosive gases!
Since mobile devices are used in various places, the surrounding gas (car exhaust gas, etc.) and sweat from the human body, can affect the contacting parts.
Tough against solder rise!
Improvements to N2 reflow and lead-free solder flux increase wetting characteristic of solder. Also, due to the miniaturization of connectors, solder rising may occur depending on conditions.
Tough against dropping